Surfect Technologies, Inc., a subsidiary of Surfect Holdings, Inc. (OTCBB: SUFH.OB), has shipped an Ascent™ 200 electroplating tool to CVInc in fulfillment of a previously announced purchase order received in November 2007. Based in Richardson, Texas, CVInc provides high quality semiconductor solutions and engineering for wafer bumping services and advanced packaging development to the semiconductor industry.
“We are pleased to deliver this tool and believe that CVInc will realize considerable benefits from Surfect’s high performance and low cost interconnect processes,” said Steve Anderson, Surfect’s chief executive officer. “We believe Surfect’s Ascent™ tool for wafer level processing creates the most cost-efficient and flexible plating solution for the highest-growth segment of the semiconductor industry.”
Surfect develops advanced electroplating solutions for solar cell and semiconductor applications using a proprietary Direct Energy Plating™ process that employs ultrasonic energy for wafer metallization. Surfect believes that this process offers a number of important benefits for its customers, including:
Significantly lower cost of metallization;
Higher throughput with greater uniformity;
Single-cell, closed system with lower utility cost and far less waste;
Ability to use multiple chemistries in a single chamber;
Scalable tool configuration that allows for incremental capacity expansion.
“We look forward to operating Surfect’s Ascent 200 plating tool and believe that implementation of the Ascent platform will help CVInc provide our customers with lower cost / higher quality plating for wafer level processes,” said Terence Q. Collier, President of CVInc.
According to industry reports, between 2007 and 2011, the production of solar cells is projected to increase more than four-fold, and the consumption of wafer level ICs is expected to double. “Reducing the cost of solar cells, increasing their efficiency, reducing the capital intensity of wafer bumping, and facilitating adoption of 'smart power' applications are key industry imperatives,” said Anderson. “Through use of our Solargy™ and Ascent™ platforms, Surfect is ideally positioned to play an important role in helping the solar and semiconductor industries address all of these objectives.”
About Surfect
Surfect is taking a leading role in providing advanced silicon interconnect solutions for semiconductor and solar cell applications by offering innovative single-cell electroplating processes utilizing the industry’s first programmable Plating Computer™. Surfect’s solutions are designed to support the growing demand for flip chip and wafer scale packaging and solar cell production through lower cost of ownership, improved process speeds, efficient design, advanced processes and reduced operational footprint. Additional information about Surfect is available on its website: www.surfect.com
About CVInc
CVInc offers strategic solutions in the areas of packaging, test, engineering development, QRA and process control. In addition, CVInc offers a unique process for bumping single die, partial wafer and full wafers with various solder alloys. CVInc was founded in 2001 to assist clients improve processes, profit and time to market. CVInc has introduced and continues to develop proprietary solutions to strengthen our market offerings. Additional information can be found on our website at www.covinc.com.
Safe Harbor
Certain statements contained in this press release are “forward-looking statements” within the meaning of the Private Securities Reform Act of 1995, including, the benefits customers including CVInc can realize using its tools and forecasts as to solar cell and integrated circuit usage. Forward-looking statements are inherently subject to risks and uncertainties some of which cannot be predicted or quantified based on current expectations. Such risks and uncertainties include CVInc’s experience using the Ascent 200 tool for their specific chemistries, configuration and product volumes as well as continued high oil and gas prices and the risks and uncertainties contained in Surfect’s Registration Statement filed on January 25, 2008 with the Securities and Exchange Commission. Although Surfect believes that the expectations reflected in such forward-looking statements are reasonable, it can give no assurance that such expectations will prove to have been correct. Consequently, future events and actual results could differ materially from those set forth in, contemplated by, or underlying the forward the forward-looking statements contained herein. Surfect does intend to update any of the forward-looking statements